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Stats Chippac Pte. Ltd.

Associate Engineer

Early Applicant
  • 18 days ago
  • Be among the first 50 applicants

Job Description

Responsibilties

. Responsible for maintenance and repair on any of the following equipment such as Laser Mark, UV-cure, AOI, TnR, Vision Systems, Inspection Station and Packing station.

. Provide technical support to manufacturing that includes machine conversion, device setup and line sustaining.

. Ensures 100% support to engineering group on device & recipe creation, equipment buy-off, evaluations, qualifications and support new product introduction NPI.

. Communicates with Manufacturing, Process, QA, Central Engineering (NPI), Pre-assy, to solve issues involving other group.

Requirements

. Possess wide application of most major concepts of specialization and ability to apply these concepts to a wide range of complex assignments.

. Requires through knowledge of practical applications of concepts, procedures and guidelines to solve extremely complex problems.

. Diploma in Electrical/ Electronics/ Mechanical / Mechatronics, Chemical, Material, Science or its equivalent with 3 - 8 years experience in similar field.

. Hands on experience in handling Laser Mark, UV-cure, AOI, TnR, Vision Systems, Inspection Station and Packing station.

. Useful experience in Wafer Bumping, Back grind and Wafer Saw

More Info

Date Posted: 28/06/2024

Job ID: 83375273

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