As the
Director of HIG HBM Media Health HVM, you will lead and develop a high-performing team to driving Media Health Manufacturing and HBM Reliability activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI's Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.
Leadership Responsibilities
- Leadership Development: By coaching and providing career development, this role ensures the growth of future leaders in the semiconductor industry, which is vital for driving innovation and technological advancement.
- Skill Enhancement: The role involves identifying strengths and creating specific development plans to improve skills. This continuous skill enhancement is crucial to keep up with the rapidly evolving technology landscape.
- Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.
- Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
- Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
- Product Alignment: Managing technical projects to align product performance and manufacturing flows across HBM products ensures consistency and high quality in the production process, which is key to the successful implementation of current and upcoming technology.
- Active Participation in Technology Events: The role requires active participation in technology events (conferences, workshops, forums etc.) within the company. This participation is crucial for staying updated with the latest trends and developments in the industry.
- Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.
Technical Responsibilities
- Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing.
- Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide the company with a technical advantage over its competition. This is vital for maintaining the company's competitive edge in the market.
- Product Development and Validation: This role is pivotal in developing, validating, characterizing, and qualifying the company's next-generation HBM products. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products.
- Support for New Product Design Verification: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies.
- Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets.
- Root Cause and Resolution of Qual and RMA Device Issues
- Time 0 and Field DPM Reduction: Leads the team who drives the DPM reduction for HBM qualification by documenting DPM FMEA, Developing and validating Stress/Screen, New DPM feature validation and deployment, Performing electrical failure analysis , understanding root cause and providing solution space. In order to achieve this role requires executing wafer level, Cube on Wafer and iQP activities, synchronize with manufacturing for tester resources, plans capacity and lab equipment.
- DPM Task Force Leadership: Leading task forces on DPM projects related to the Fab process requires ownership within PE and coordination with multiple teams. This role is essential for addressing and resolving critical issues coming from component and system platform that may arise during the qualification process.
- Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of NAND products, which are key components in many modern technologies.
- Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.
Requirements
- Bachelors/Masters Electrical Engineering Degree with 10+ years of experience in the semiconductor industry. The company and Product Engineering Experience is preferred.
- Demonstrating Strong Leadership Skills and Technical Skills 10+ years of experience in the semiconductor industry.
- Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
- Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
- Strong sense of responsibility and accountability towards assigned role with professional work ethic.
- Work on site in Singapore with international travel to Taiwan and USA
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