Integrated Circuit Packaging Engineer

Responsibilities:

1. Responsible for packaging solutions and design, defining performance criteria for signal integrity (SI), power integrity (PI), and thermal performance.

2. Optimize power performance in packaging design, focusing on PI and SI parameters.

3. Manage collaboration and technical communication with packaging and testing vendors.

Requirements:

1. Bachelor's degree or higher in Electronic Engineering, Microelectronics, Computer Science,

or a related field.

2. Minimum of 5 years of experience in packaging design and development, or experience in

project development at a design company.

3. Strong communication and coordination skills, teamwork spirit, and resilience under

pressure.

4. Proficiency in both written and spoken English and Chinese is a plus.