Please join us!
Responsibilities;
Line sustaining for dry process (i.e. Sputter, Photolithography and Descum)
Line sustaining for wet process (i.e. Metal Etch, Plating and PR Strip)
Support lot dispositions and OCAP executions
Involve in Continuous Improvement Projects
Working with QM Dept. to response customer inquires and issues
Execute CIP or project handling that contributes yield & cost efficiency improvement
Ensure SPC is maintain and in control
Support new material evaluation and new tool set up
Requirements;
Diploma in electronics or related disciplines
Preferably with minimum 3 years experience in Wafer bumping process running high volume
Knowledge in: Statistic Process Control (SPC), Out Of Control Procedure (OCAP)
Cleanroom/Semiconductor experience preferred. Experience in dynamic manufacturing
Familiar in FMEA, 8D and DOE execution approach is an advantage
Able to work in rotating shift (day & night shift)
