Process Associate Engineer (Die Prep) is responsible to support the engineering activities as well as the daily production activities reliably and efficiently.
Candidates with related experience in semiconductor and/or electronics manufacturing industry are encouraged to apply for this position.
Responsibilities
- Ensure process integrity for machine related to production
- Process monitoring via SPC / real time monitoring system
- Work on process improvement projects
- Handle disposition and on hold lots
- Maintain good housekeeping in the production area
- Support in recipe setup and qualification for production
- Assist to troubleshoot process-related issue
- Collect engineering data
- Any other ad-hoc duties as assigned by reporting supervisor
Requirement
- Minimum diploma in electrical / mechatronics / mechanical/ microelectronics engineering or similar discipline
- Minimum 2 years experience working in semiconductor manufacturing environment
- Minimum 2 years of experience working in Die Preparation process such as Backgrind, Dicing and Laser-grooving.
- Knowledge in basic SPC and Microsoft Office
- Flexible to work under various shift pattern. The selected candidate will start with office hours first, and eventually work on 12-hour rotating shift (day and night)
