Work with stakeholders to ensure the QMS is accurate and adhere to in relation to New Products, Prototype, or first few pilot machines, especially for AP (Advance Packaging) areas.
Responsible for reviewing product BOM structure and drawings, process flow charts of entire supply chain from vendor to post shipment servicing, design reviews and validation plans.
Manage first article inspection (FAI), and closely monitor parts quality at initial lots, before released for mass production.
Works with production and engineering to develop an effective measurement metrology (MSOP), improve in-process inspection and measurement, be it at part level, module level or machine level. Get the whole list of part MSOP ready before hand over to mass production team.
Assure acceptance and methodologies are fully documented with appropriate test coverage, such that product inspection / validation / testing is properly performed, including develop, maintain and revise validation / test requirements.
Actively participating in design reviews activities and provide input for new product development.
Develop PPAP, incoming control plan for critical purchasing parts that are Critical to Quality CTQ and Critical to Function CTF, by ensuring form, fit, function and cosmetic requirement in part, module, and machine level.
Actively use 3P principles (Protect, Prevent, Predict) to drive for root cause analysis and CAPA using tools such as 8D, 5Why, FTA, MBPS, etc. Prepare lesson learnt to cascade to other relevant products and be the owner of centralized product QE and/or customer QE.
Work closely with internal customers to ensure production reject DPPM and cycle time is at satisfactory level.
Work closely with Field Service Team to collect field feedback. For customer complaints, facilitate related stakeholders to output the Root Cause, Corrective Actions and Preventive Actions.
Apply statistical method for data analysis with tool like Minitab.
Responsible to ensure zero customer complaint from NPI/Pilot builds, and be the focal person in driving problem solving end-to-end.
Upkeep quality KPI such as total customer detractor rate (TCDR), opportunity cost (eOPR), scrap cost etc in accordance to organization metric especially for AP Advance Packaging areas.
Requirements:
Candidate must possess at least a Bachelor's Degree in Mechanical/Electronic/Manufacturing Engineering or equivalent.
At least 3-5 year(s) of working experience with direct involvement in manufacturing and product development setting in the semiconductor equipment maker industry.
Possess good and effective communication skill with all levels with the organization, supplier and customers.
Able to implement and carry-out improvement opportunities to identify profits and increase productivity.
Strong technical knowledge, hands on with product, process.
Experienced in the application of quality tools essential to new product development such as DFMEA, PFMEA and Quality Control Plans, end-to-end yield, panther chart, 8D, Six Sigma, DMAIC etc.
Hands on using statistical analysis and tool such as Minitab etc.