As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.
This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.
JOB RESPONSIBILITIES
Promote worldwide synergy
- Improve benchmark performance and efficiency gains through global project management and execution
- Network BKM leveraging and enhancement, business process creation and re-engineering
- Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
- Help drive and fix the issue where necessary
Drive FE-AT Integration initiatives
- Business process governance between Fab - Assembly (WSPEC, FE2BE forum, WPSWAT)
- Lead & drive FE-AT excursions
- Yield, DPM related issues that involves both Fab - Assembly
Cross sites benchmark & achieve BIC yield performance
- Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow
Identify, Propose & Drive new initiatives programs
- Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
- Process flow simplifications & standardizations
- Cross technology streamline (Process, tools, etc)
- Sites expansions process & qualification requirements
- Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)
JOB QUALIFICATIONS
- Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
- 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
- Strong background in frontend fabrication processes (FAB)
- Proven experience in data analysis, statistical process control (SPC), and process optimization.
- Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
- Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
- Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
- Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
- In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.
