Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
Reviews and analyses customer's specifications and requirements in terms of material, process and assembly specification
Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer
Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
Develop and grow people project management skills, adopting on dynamic changes and crisis management
Drive for productivity improvement and cost reduction in process integration
Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue
Requirements:
Degree/Diploma in Electrical/Electronics, Engineering or equivalent
Minimum 3 years of Engineering experience in Semiconductor manufacturing industry
Preferably with Project Management Certification
Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred
Knowledge on WLCSP bumping process of 2P2M DOE/SPC / FMEA /JMP/ APQP standard
Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred
