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Responsibilities:
1. Responsible for IC packaging solutions and design, defining performance criteria for signal integrity (SI), power integrity (PI), and thermal performance.
2. Optimize power performance in packaging design, focusing on PI and SI parameters.
3. Manage collaboration and technical communication with packaging and testing vendors.
Requirements:
1. Bachelor's degree or higher in Electronic Engineering, Microelectronics or a related field.
2. Minimum of 5 years of experience in packaging design and development, or experience in project development at a IC design company.
3. Strong communication and coordination skills, teamwork spirit, and resilience under pressure.
Bachelors/ Degree
Date Posted: 11/11/2024
Job ID: 99844089
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