Perform mechanical & thermal analysis and characterization of advanced IC packages
Build up new mechanical & thermal capabilities with latest simulation and characterization technologies
Design advanced packages for customers to meet their reliability and manufacturability specifications & needs
Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance
Conduct IC packaging technology development together with other teams
Carry out mechanical, thermal and reliability test and correlate with mechanical & thermal simulation for validation
Requirements
Degree / Master in Mechanical Engineering or related field
Solid knowledge on FEM & mechanics of material
Mechanical modeling experience for IC package's stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqus is a must
Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in WLCSP, and wire bonding using simulation software such as Ansys & Abaqus is preferable
Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable
Thermal Modeling experience using CFD software such as Flotherm / Icepak is highly desirable
Team player with good interpersonal and communication skills
Keen for R&D activities in IC packaging technology development, package's mechanical & thermal analysis/ design/ optimization/ characterization
