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Stats Chippac Pte. Ltd.

Senior/Process Engineer (Wet Etch/Plating)

Early Applicant
  • 22 days ago
  • Be among the first 50 applicants
Exp: 5-7 Years
3,500 - 6,000 SGD/m

Job Description

Key Job Accountabilities :

. Set-up wet etch and plating processes

. Write process specifications and operator instructions

. Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers requirements in terms of cost, yield and cycle time

. To provide interim and long-term corrective actions for any discrepancies

. Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities

Required Experience and Qualifications :

. Requires Degree in Physics, Chemical, Material Science, Electrical/Electronics Engineering or equivalent

. Minimum 2 years of relevant experience in wafer bumping or wafer fabrication technology in wet etching chemistry, and/or Plating technology

. Ability to work on 12-hour rotating shifts or swing shift if required

Date Posted: 06/11/2024

Job ID: 99304611

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Last Updated: 19-11-2024 04:50:56 PM
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