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Key Job Accountabilities :
. Set-up wet etch and plating processes
. Write process specifications and operator instructions
. Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers requirements in terms of cost, yield and cycle time
. To provide interim and long-term corrective actions for any discrepancies
. Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities
Required Experience and Qualifications :
. Requires Degree in Physics, Chemical, Material Science, Electrical/Electronics Engineering or equivalent
. Minimum 2 years of relevant experience in wafer bumping or wafer fabrication technology in wet etching chemistry, and/or Plating technology
. Ability to work on 12-hour rotating shifts or swing shift if required
Role:Other Production/Engineering/R&D
Industry:Other
Function:Manufacturing/Engineering/R&D
Job Type:Permanent Job
Date Posted: 06/11/2024
Job ID: 99304611