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NXP SEMICONDUCTORS SINGAPORE PTE. LTD.

Technology Development DEVICE Principal ENGINEER

Early Applicant
  • 8 days ago
  • Be among the first 50 applicants
Exp: 8-10 Years
10,000 - 17,000 USD/m

Job Description

Job Duties:

. Supporting business users on application incidents/ changes requested on SW environment applications and infrastructure.

. Responsible for Yield Enhancement and Defect reduction for a specified module of the process flow across all CHD-FAB technologies.

. Involves using in-line inspection and defect review data to react to defect excursions, improve baseline defect levels, and support defect analyses for planned changes within the module.

. Determine root cause of defect issues, and drive resolution.

. Partnering with process engineering to reduce tool-level defect levels (both excursion reduction and baseline improvement).

Job Qualifications

. Bachelor's degree or above in electrical, chemical, materials engineering.

. 8+ years of semiconductor experience in yield enhancement and/or integration preferable.

. Process and/or device engineering experience and background is a plus.

. MFG/Fab Experience: Understanding of Device Integration and Manufacturing, Statistical Data Analysis skills (SPC, DOE, etc.), Data retrieval skills (Klarity, Datalog, JMP, etc).

. Preferable Yield Enhancement Knowledge / Experience: Experience with bright field inspection tools, Experience with SEM imaging and analysis, Knowledgeable in yield enhancement data analysis (Kill Ratios, Defect contribution (adders), etc).

. Excellent communication and presentation skills across various levels of the company.

. Should be a team player and willing to work with cross functional teams in issues resolution.

More Info

Industry:Other

Function:Manufacturing

Job Type:Permanent Job

Skills Required

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Date Posted: 20/11/2024

Job ID: 100957595

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Last Updated: 20-11-2024 07:02:48 PM
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