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Fresher ic packaging jobs
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7
Ic Packaging Jobs
Senior Engineer - Design & Simulation
UTAC
Permanent Job
Singapore
3-5 years
Auto-CAD
ALLEGRO
Pcb
IC packaging
laminate substrate design software
analytical
Cadence APD
communication
Interpersonal
Problem-solving
a month ago
R&D Process Engineer
Broadcom
Permanent Job
Singapore
0-2 years
encapsulation Molding
vision inspection tools
IC packaging
NPI project leadership
high voltage isolation requirements
package trim/forming
semiconductor packaging process development
Wire bond
mechanical lead-frame design rules/ tools
Die Attach
semiconductor physical failure analysis
material and processing techniques
a month ago
Senior IC Package Design Engineer
Ethos Search Associates Pte Ltd
Permanent Job
Singapore
5-13 years
5000 - 9500 SGD monthly
EMI/EMC
power integrity
Flip Chip
Wirebonding
Signal Integrity
IC design
Package Design
Layout Design
thermal analysis
3d packaging
10 hours ago
Senior Mechanical Engineer
Utac Headquarters Pte. Ltd.
Permanent Job
Singapore
5-7 years
4000 - 6000 SGD monthly
thermal analysis
Modeling
Stress
Technology Development
Reliability
characterization
Packaging
ABAQUS
Communication Skills
Molding
Team Player
Assembly
Ic
CAD
Mechanical Engineering
ANSYS
15 days ago
Package Manager
Seatrium (sg) Pte. Ltd.
Permanent Job
Singapore
7-10 years
7000 - 12000 SGD monthly
Negotiation
Warehousing
EPC projects
Able To Multitask
Material Procurement
Construction
Epc
Electrical
procurement systems
Construction Safety
Procurement
Packaging
end to end procurement
procurement tenders
Ic
Commissioning
Marine Construction
SAP
22 days ago
AG59-Production Test Manager (Teradyne J750| ATE Test Program |Up to $7,000 )
The Supreme Hr Advisory Pte. Ltd.
Permanent Job
Singapore
5-7 years
10000 - 12000 SGD monthly
program development
Reliability
characterization
KEE
Packaging
Banking
Ic
Stakeholder Management
Manufacturing
Python
Software Testing
Selenium
Debugging
28 days ago
Failure Analysis Engineer, Singapore
Apple
Permanent Job
Singapore
3-5 years
Failure Analysis
surface morphology
Process
auger
Sem
root cause identification
fib
optical devices
nano-indenter
x-ray
ic assembly packaging design
Simulation
semiconductors
Testing
a month ago
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