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Job Description:
Responsible for designing/ implementing packaging process of new isolation products. Evaluates reliability of materials, properties and techniques, explore new process methodology used in production. Perform Design of Engineering Experiment (DOE) and optimization of new developed processes. Carry out R&D programs with IC designer, product engineer and manufacturing team, various support functions and contract Manufacturer to develop and perform process validation of new devices. Perform process yield analysis and failure investigation of new device issues. Plan and carry out engineering programs to achieve cost targets, breakthrough improvement in manufacturing yield, quality and reliability
Requirement:
We are looking for an experienced R&D process engineer (Optocoupler). We need people with a strong ME background, semiconductor packaging process development skill. e.g. Die Attach, Wire bond, encapsulation Molding, package trim/forming, vision inspection tools Demonstrated and proven analytical/ critical thinking, problem solving and solution provider. Familiarized with mechanical lead-frame design rules/ tools, knowledge in semiconductor physical failure analysis. Experience in IC packaging, high voltage isolation requirements, material and processing techniques. Roles in NPI project leadership, taking product from verification/ qualification to high volume soft launch is advantageous.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
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