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Job Description:
Carry out Bump Mask Design tasks to meet customer requirements and making sure that design outputs are aligned to bumping design guidelines and capability
Design-need to consider all aspect to optimize layout for best possible product performance, consider impact to yield and minimize final product cost
Responsible for the Design output and need to be in proper Bump Mask Tooling format with accurate information and promptly reviewed and approved by authorized UTAC personnel and customer
To ensure proper documentation and maintenance of his/her design outputs according to UTAC design verification procedure
Proficient with Auto-Cad with at least 3 years working experience using ACAD for Bump Mask Design
Background on IC packaging / assembly processes and experience in using Cadence APD / Allegro or other PCB/ laminate substrate design software is an added advantage
Requirements:
Degree in Engineering/Science
Minimum 3 years experience in Bump Mask Design with knowledge of bumping processes
Strong understanding of bumping technologies, materials, and equipment
Proven experience in process development, optimization, and troubleshooting
Excellent analytical and problem-solving skills
Ability to work effectively both independently and as part of a team
Strong communication and interpersonal skills
Attention to detail and commitment to quality
Knowledge of industry standards and best practices
